男人添女人下部高潮视频,最近手机中文字幕高清大全,精品人妻大屁股白浆无码,国产免费无码一区二区视频

Your Position: Home > Support > Service Center

Microsoft joined a new generation of DRAM groups of HMCC reason

2012/8/16      view:

  In May 8, 2012, promote the use of TSV ( TSV ) 3D laminated to a new generation of DRAM " Hybrid Memory Cube ( HMC ) Hybrid Memory Cube Consortium " popularity ( HMCC ) announced that the United States, software giant Microsoft has joined the association.

  HMC is the three-dimensional structure, the logic chip along the vertical direction superposition of multiple DRAM chips, and then through the TSV connection wiring technology. HMC 's biggest characteristic is compared with existing DRAM, performance can be greatly improved. The reasons there are two, one is between chips from semiconductor package wiring distance on a board on the traditional methods of " cm " units are substantially reduced to dozens ofμ m~ 1mm; two is on a chip to form 1000 to tens of thousands of TSV, realize the multipoint connection chip.

  Microsoft 's accession to the HMCC, because we are considering how to corresponding is likely to become a personal computer and a computer to improving the performance of " memory bottleneck " problem. Memory bottleneck refers to as the microprocessor performance through multiple nucleation and constantly improve, the architecture of the DRAM performance will not be able to meet the need of processor. If do not solve this problem, can occur even if the computer new product, the actual performance is also not appropriate promotion situation. Compared with it, if the TSV based on the application of HMC in computer main memory, the data transmission speed can be increased to the current DRAM is about 15 times, therefore, is not just a giant Microsoft, American companies such as Intel are also active in research using HMC.

  In fact, plans to use TSV not only for HMC and other DRAM products. According to the semiconductor manufacturers plan, in the next few years, borne from electronic equipment input function of the CMOS sensor to the responsible for the operations of FPGA and multi core processor, and in charge of product storage of DRAM and NAND flash will have to import TSV. If the plan goes ahead, TSV will assume the input, operation, storage and other electronic equipment main function.

又粗又硬又黄A级毛片| 漂亮人妻被黑人久久精品 | 扒开双腿抽打花蒂惩罚室| 蜜芽796.COO永不失联| 久久99精品国产麻豆婷婷| 国色天香精品一卡2卡3卡4| 免费高清理伦片A片在线观看| 少妇扒开腿让我爽了一夜| 色欲色香天天天综合VVV| 你的东西太大了我装不了| 色欲色香天天天综合VVV| 娇小白人女VS巨大黑迪克| 国产精品久久久久久久久久久| 把腿张开我要CAO死你| 国精品无码一区二区三区在线蜜臀 | 精品无码人妻一区二区三区| 国产免费AV片无码永久免费| 亚洲熟妇无码一区二区三区导航 | 国产精品99久久久久久宅男| 久久久亚洲AV波多野结衣| 中文字幕在线播放| 日本19禁啪啪吃奶大尺度| 男男GAY啪啪网站18禁| 息与子五十路孕中文字幕| 被债主在夫面前人妻被强| 国产精品久久久久9999高清| 精品久久久久久无码人妻热| 97在线视频人妻无码| 国产AV天堂无码一区二区三区| 最近免费中文字幕中文高清6| 免费真人视频APP| 疯狂的肥岳交换130部小短片| 小妖精腰细奶大H侍卫| 国产亚洲精品久久久久久国模美 | 无码精品人妻一区二区三区AV| 久久久久女人精品毛片| 精品久久久久久无码专区不卡| 对白荡伦系列之子你不能这样我| 少妇被粗大猛进去69影院| 精品综合久久久久久98| 蜜臀AV免费一区二区三区|